HP PAVILION DV7 Maintenance And Service Manual page 99

4. Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink assembly
from side to side to detach the assembly.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste
is used on the processor (1) and the heat sink section (2) that services it. Thermal pads are used
on the Northbridge chip (3) and Northbridge contact (4), the graphics subsystem chip (5) and
graphics/heat sink contact (6) and various capacitors and their contacts (7). Replacement thermal
material is included with all fan/heat sink assembly, system board, and processor spare part kits.
5. Turn the system board upside down, with the expansion port and external monitor port toward you.
6. Disconnect the fan cable (1) from the system board.
7. Loosen the three Phillips captive screws (2) that secure the fan/heat sink assembly to the system
board.
Component replacement procedures 91