Reference Designator And Abbreviations - HP 16500A Service Manual

A =assembly
B =fan;motor
BT =battery
C =capacitor
CR =diode;diode thyristor;
varactor
DL =delay line
DS =annunciator;lamp;LED
E =misc. electrical part
A
A/D =amperes
AC =analog-to-digital
ADJ =alternating current
AL =adjust(ment)
AMPL =aluminum
ANLG =amplifier
ANSI =analog
=American National
ASSY Standards Institute
ASTIG =assembly
ASYN- =astigmatism
CHRO =asynchronous
ATTEN =attenuator
AWG =American wire gauge
BAL =balance
BCD =binary-code decimal
BD =board
BFR =buffer
BIN =binary
BRDG =bridge
BSHG =bushing
BW =bandwidth
C =ceramic;cermet
(resistor)
CAL =calibrate;calibration
CC =carbon composition
CCW =counterclockwise
CER =ceramic
CFM =cubic feet/minute
CH =choke
CHAM =chamfered
CHAN =channel
CHAR =character
CM =centimeter
CMOS =complementary metal-
oxide-semiconductor
CMR =common mode rejec-
tion
CNDCT =conductor
CNTR =counter
CON =connector
CONT =contact
CRT =cathode-ray tube
CW =clockwise
D =diameter
D/A =digital-to-analog
DAC =digital-to-analog
converter
DARL =darlington
DAT =data
DBL =double
DBM =decibel referenced
to 1mW
DC =direct current
DCDR =decoder
DEG =degree
DEMUX =demultiplexer
DET =detector
DIA =diameter
DIP =dual in-line package
DIV =division
DMA =direct memory access
DPDT =double-pole,
double-throw
DRC =DAC refresh controller
DRVR =driver
Table 5-1. Reference Designator and Abbreviations
REFERENCE DESIGNATOR
F =fuse
FL =filter
H =hardware
J =electrical connector
(stationary portion);jack
L =coil;inductor
MP =misc. mechanical part
P =electrical connector
(moveable portion);plug
ABBREVIATIONS
DWL
ECL
ELAS
EXT
F
FC
FD
FEM
FF
FL
FM
FR
FT
FW
FXD
GEN
GND
GP
GRAT
GRV
H
HD
HDND
HG
HGT
HLCL
HORIZ
HP
HP-IB
HR
HV
HZ
I/O
IC
ID
IN
INCL
INCAND
INP
INTEN
INTL
INV
JFET
JKT
K
L
LB
LCH
LCL
LED
LG
LI
LK
LKWR
LS
LV
M
MACH
MAX
HP 16500A/16501A - Replaceable Parts
Q =transistor;SCR;
triode thyristor
R =resistor
RT =thermistor
S =switch;jumper
T =transformer
TB =terminal board
TP =test point
=dowel =kilo(103)
=emitter =low
coupled =pound
logic =latch
=elas- =local
tomeric =light-emitting
=external diode
=far- =long
ads;metal =lithium
film =lock
(resistor) =lockwasher
=carbon =low power Schottky
film/ =low voltage
composi- =mega(106);megohms;
tion meter(distance)
=feed =machine
=female =maximum
=flip-flop
=flat
=foam;from
=front
=gain band-
width
product
=full wave
=fixed
=generator
=ground(ed)
=general
purpose
=graticule
=groove
=hen-
ries;high
=hardware
=hardened
=mercury
=height
=helical
=horizontal
=Hewlett-
Packard
=Hewlett-
Packard
Interface
Bus
=hour(s)
=high volt-
age
=Hertz
=input/out-
put
=integrated
circuit
=inside di-
ameter
=inch
=include(s)
=incandes-
cent
=input
=intensity
=internal
=inverter
=junction
field-
effect tran-
sistor
=jacket
U =integrated circuit;
microcircuit
V =electron tube; glow
lamp
VR =voltage regulator;
breakdown diode
W =cable
X =socket
Y =crystal unit(piezo-
electric or quartz)
MFR =manufacturer
MICPROC =microprocessor
MINTR =miniature
MISC =miscellaneous
MLD =molded
MM =millimeter
MO =metal oxide
MTG =mounting
MTLC =metallic
MUX =multiplexer
MW =milliwatt
N =nano(10-9)
NC =no connection
NMOS =n-channel metal-
oxide-semiconductor
NPN =negative-positive-
negative
NPRN =neoprene
NRFR =not recommended for
field replacement
NSR =not separately
replaceable
NUM =numeric
OBD =order by description
OCTL =octal
OD =outside diameter
OP AMP =operational amplifier
OSC =oscillator
P =plastic
P/O =part of
PC =printed circuit
PCB =printed circuit board
PD =power dissipation
PF =picofarads
PI =plug in
PL =plate(d)
PLA =programmable logic
array
PLST =plastic
PNP =positive-negative-
positive
POLYE =polyester
POS =positive;position
POT =potentiometer
POZI =pozidrive
PP =peak-to-peak
PPM =parts per million
PRCN =precision
PREAMP =preamplifier
PRGMBL =programmable
PRL =parallel
PROG =programmable
PSTN =position
PT =point
PW =potted wirewound
PWR =power
R-S =reset-set
RAM =random-access
memory
RECT =rectifier
RET =retainer
RF =radio frequency
RGLTR =regulator
RGTR =register
RK =rack
RMS =root-mean-square
5-3