Removal and Replacement Procedures— Microtower Type 2 Chassis
6.5 Memory Modules
For more information on memory used in these computers refer to
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CAUTION: The memory module sockets have gold metal contacts. When upgrading the memory, it is
important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation
resulting from having incompatible metals in contact with each other.
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CAUTION: Static electricity can damage the electronic components of the computer or optional cards.
Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching
a grounded metal object. Refer to Chapter 5 for more information.
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CAUTION: When handling a memory module, be careful not to touch any of the contacts. Doing so
may damage the module.
1. Prepare the computer for disassembly
✎
If there is a hard drive in bay 5 it will be necessary to remove the lower drive cage before
removing the memory modules
2. Remove the right access panel
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WARNING: To reduce risk of personal injury from hot surfaces, allow the internal system components to
cool before touching.
3. Lay the computer down on its side to make it easier to work on.
6–6
(Section 6.1, "Preparation for
(Section 6.7.4, "Removing the Lower Drive
(Section 6.2, "Access
336493-004
Appendix
E.
Disassembly").
Cage").
Panel").
Service Reference Guide, d200