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Hardware Specifications and Configurations
Processor
Item
CPU
Type
CPU package
Features
CPU Power
North Bridge
Item
Type
Package
Features
Power
18
AMD CPU S1g2 Processor (Griffin Series - Turion / Sempron);
HT3 (1.2~2.6 GT/s) (Bandwidth: 9.6GB/S to 20.8GB/s)
1.8GHZ~2.3GHZ
AMD 638 pin Micro-PGA
Hyper Transport 3.0 Technology: Designed to support HT
•
Gen3 speeds from 1.2GHZ to 2.6GHZ.
64-bit or 128-bit DDR2 Memory Interface: Two independent
•
64-bit DDR2 channels.
Split Power Planes: Separate power planes provided for each
•
CPU core and on die Northbridge
Up to 2 processor cores per die, Up to 1MB L2 cache per die.
•
Each CPU core supports up to 8 P-states: P0 (Highest
•
performance) and P7
VDD0, VDD1 set according to the respective P-state control
•
when core VDD are isolated and VDD set according to the
CPU core in the highest performance P-state when VDD is
common.
CPU_VDDNB; VLDT 1.2V_HT; VDD I/O 1.8VSUS; CPU
•
Memory Interface
AMD RS780M (North Bridge)
FCBGA 528-pin
CPU Hyper Transport Interface: Support 16-bit up/down Hyper
•
Transport 3.0 interface up to 5.2GT/S.
PCI Express Interface: Support PCI-E GEN2; Optimized peer
•
to peer and general purpose link performance; Highly flexible
PCI Express implementation to suit a variety of platform needs.
A-Link Express II interface: one x4 A-Link Express II Interface
•
for connection
1.1V, 1.2V, 1.8V, 3.3V
Specification
Specification
Chapter 1
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