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ADC 75 Ohm Interconnect Specification Sheet

Digital monitor module system 75 ohm interconnect

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Digital Monitor Module System
75 Ohm Interconnect
Designed as a flexible solution for network signal management, ADC's Digital Monitor Module
(DMM) system provides a centralized coaxial termination and interconnection point between
network elements (NE). The DMM system allows a permanent, dedicated connection between
two NEs while providing dual, nonintrusive test access points for bidirectional monitoring of
the network signal. Ensuring unsurpassed quality, this interconnect solution features cable
management designed to increase reliability, maintain signal flow, and allow easy cable
identification. To enhance network flexibility, the DMM system allows modules to be installed
in a chassis as network requirements increase.
Features:
• Provides bidirectional, nonintrusive signal testing
• Supports E1 (2.048 Mbps), E3 (34.368 Mbps), or STM-1 (155.52 Mbps) signal rate applications
• Modular design allows for capital investment to coincide with revenue growth
• Mounts in standard 600 mm bays
• Quality cable management and circuit identification markings
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Summary of Contents for ADC 75 Ohm Interconnect

  • Page 1 Digital Monitor Module System 75 Ohm Interconnect Designed as a flexible solution for network signal management, ADC’s Digital Monitor Module (DMM) system provides a centralized coaxial termination and interconnection point between network elements (NE). The DMM system allows a permanent, dedicated connection between two NEs while providing dual, nonintrusive test access points for bidirectional monitoring of the network signal.
  • Page 2 Digital Monitor Module System 75 Ohm Interconnect Application The DMM system is used primarily in co-location environments, DDF locations, and customer premises as a connection point between NEs. Each NE is semipermanently cabled to IN/OUT connectors in either the front or rear of each module. The digital signal is accessed through the two MON OUT connectors on the front of each module for testing and monitoring.
  • Page 3 Digital Monitor Module System 75 Ohm Interconnect Configurations The DMM system is available in several chassis and rack configurations to create a customized interconnect solution. Each module is ordered separately and may be installed in any DMM chassis or rack configuration as the network expands, allowing capital investment to coincide with revenue growth.
  • Page 4 Digital Monitor Module System 75 Ohm Interconnect Modules Features: • Front, dual monitor ports on all module styles • BNC or 1.6/5.6 connectors provide true 75 Ohm characteristic impedance • All module styles are compatable with any DMM 600 mm chassis style...
  • Page 5: Standard Configuration

    Digital Monitor Module System 75 Ohm Interconnect Standard Configuration Features: • 288 total circuits in fully loaded bay • Cable bars and front cable trays, with cable tie-downs, reduce cable congestion and simplify maintenance • Circuit designation labels above connectors and on cable tray ensure proper cable routing and identification •...
  • Page 6: High-Density Configuration

    Digital Monitor Module System 75 Ohm Interconnect High-Density Configuration Features: • Improved circuit density by 20%; 352 circuits in fully loaded bay • Cable bars reduce cable congestion and simplify maintenance • Circuit designation label door ensures proper cable routing and identification •...
  • Page 7: Wall-Mount Box

    Digital Monitor Module System 75 Ohm Interconnect Wall-Mount Box Features: • Used as a demarcation point when NEs are supplied by the service provider and by the customer premises • Seperate locks on each door secure connections from unwanted access...
  • Page 8: Specifications

    From North America, Call Toll Free: 1-800-366-3891 • Outside of North America: +1-952-938-8080 Fax: +1-952-917-3237 • For a listing of ADC’s global sales office locations, please refer to our web site. ADC Telecommunications, Inc., P.O. Box 1101, Minneapolis, Minnesota USA 55440-1101 Specifications published here are current as of the date of publication of this document.

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